Company Profile - TongFu Microelectronics Co Ltd

Introduction

TongFu Microelectronics Co Ltd (TongFu) carries out the business of assembling and testing integrated circuits (ICs). The company provides low-end products including dual-in-line package (DIP) and single-in-line package (SIP) series, and medium-and high-end products such as small outline package (SOP) series, and quad flat package (QFP) series and plastic transistor outline package (TO) series. Its products include qual flat no-lead (QFN) package series and dual flat no-lead (DFN) series by using surface mount technology (SMD) technology. The company products are mainly used in home appliances, digital communications, wireless communications, power management and automobile electronic sectors, among others. TongFu is headquartered in Nantong, Jiangsu, China.